Intel will produce future custom 5G SoC for Ericsson on 18A process technology
Announcement demonstrates confidence in 18A process technology and underscores progress on Intel’s five-node roadmap in four years to regain process leadership.
The news shows the companies’ continued collaboration to optimize standard Intel® Xeon® Scalable processor-based platforms for Ericsson’s Cloud RAN solutions.
Industry leaders are driving 5G adoption and building sustainable and resilient networks of the future.
SANTA CLARA, Calif.–(BUSINESS WIRE)–Intel today announced a strategic partnership agreement with Ericsson to leverage Intel’s 18A process and manufacturing technology for Ericsson’s future next-generation optimized 5G infrastructure.
As part of the agreement, Intel will manufacture custom 5G system-on-chip (SoCs) for Ericsson to create highly differentiated leading products for future 5G infrastructure. In addition, the companies will expand their collaboration to optimize 4th Gen Intel® Xeon® Scalable processors with Intel® vRAN Boost for Ericsson’s Cloud RAN (radio access network) solutions to help communications service providers increase network capacity and energy efficiency while gaining greater flexibility and scalability.
“As our partnership evolves, this is an important milestone for Ericsson to collaborate broadly on their optimized next-generation 5G infrastructure. This agreement illustrates our shared vision to innovate and transform network connectivity, and reinforces customers’ growing confidence in our process and manufacturing technology,” said Sachin Katti, senior vice president and general manager of the Network and Edge group at Intel. “We look forward to working with Ericsson, an industry leader, to build networks that are open, reliable and ready for the future.”
18A is Intel’s most advanced node on the company’s five-node roadmap in four years. After the new gate-all-round transistor architecture – known as RibbonFET – and backside power delivery – called PowerVia – make its first appearance in Intel 20A, Intel will deliver ribbon architecture innovation and improved performance, along with a continued reduction in metal linewidth in 18A. Combined, these technologies will put Intel back in the process leadership position by 2025, driving its customers’ future offerings to market.
“Ericsson has a long history of working closely with Intel, and we are excited to expand this further as we use Intel to manufacture our future custom 5G SoCs on their 18A process node, which aligns with Ericsson’s long-term strategy for a more resilient and sustainable supply chain,” said Fredrik Jejdling, executive vice president and head of Networks at Ericsson. “In addition, we will expand our partnership we announced at MWC 2023 to partner with the ecosystem to accelerate open RAN at industrial scale using standard Intel Xeon-based platforms.”
The future is open and scalable
As 5G deployments continue, the future lies in fully programmable, open software-defined networks powered by the same cloud-native technologies that have transformed the data center, providing unparalleled flexibility and automation.
To achieve the best performance, innovation and global scale, the industry must work together and continue to synchronize network specifications as part of a single global set of standards. Intel and Ericsson are working with other leading technology companies to bring these benefits to their customers toward open RAN at an industrial scale.
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to improve semiconductor design and manufacturing to address our customers’ biggest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. For more information on Intel innovations, visit newsroom.intel.com and intel.com.
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Source: Intel Corporation
Released July 25, 2023 • 4:10 PM EDT